One-component Epoxy Adhesives
Stable quality.
Excellent heat resistance, durability and chemical resistance!
Technodyne® AH is a one-component epoxy adhesive in which the resin and curing agent are pre-integrated.
It cures upon heating to form a strong adhesive layer.
It eliminates the need for mixing, improving workability and reducing quality variations.Suitable for a wide range of substrates including metals, engineering plastics, resins, and ceramics, it is widely used for bonding and encapsulation of electronic components.
Multiple grades are available, optimized for viscosity, curing conditions, and mechanical, electrical, and thermal properties to meet specific application and process requirements.
Applications
Bonding and encapsulation of electronic components
- Sealing and bonding of relay components
- Fixing of coil cores, parts, and magnets
- Encapsulation and bonding of switch components
- Fixing of motor components
- Encapsulation and bonding of connector components
- Fixing of various chip components
Other Applications
- Base resin for conductive pastes
- Fixing of optoelectronic components
- Reinforcement of abrasive materials
Technodyne ®series
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| High-reliability grade | Low modulus grade | Product in development |
| Excellent heat resistance, low outgassing, reflow soldering resistance, and exhibits strong adhesion even to difficult-to-bond materials such as LCP and PA. | Combines flexibility with heat resistance. Prevents crack formation during thermal shock testing and provides vibration damping and noise reduction. | Flame-retardant adhesive, High-strength and high-heat-resistant adhesive, Thermally conductive adhesive, Low-temperature curing grade |